(China (Mainland))
Product Summary
The XQ4036XL-3HQ240N is a igh-performance, high-capacity Field Programmable Gate Array, which provides the benefits of custom CMOS VLSI, while avoiding the initial cost, long development cycle, and inherent risk of a conventional masked gate array. The result of thirteen years of FPGA design experience and feedback from thousands of customers, these FPGAs combine architectural versatility, on-chip Select-RAM memory with edge-triggered and dual-port modes, increased speed, abundant routing resources, and new, sophisticated soft-ware to achieve fully automated implementation of complex, high-density, high-performance designs.
Parametrics
Absolute maximum ratings: (1)VCC, Supply voltage relative to GND: –0.5 to 4.0 V; (2)VIN, Input voltage relative to GND: –0.5 to 5.5 V; (3)VTS, Voltage applied to High-Z output: –0.5 to 5.5 V; (4)VCCt, Longest supply voltage rise time from 1V to 3V: 50 ms; (5)TSTG, Storage temperature (ambient): –65 to +150 °C; (6)TSOL, Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm): +260 °C; (7)TJ, Junction temperature: Ceramic package: +150 °C;Plastic package: +125 °C.
Features
Features:(1)Certified to MIL-PRF-38535 Appendix A QML(Qualified Manufacturer Listing); (2)Ceramic and plastic packages; (3)Also available under the following standard microcircuit drawings (SMD): XQ4036XL 5962-98510; (4)For more information contact the Defense Supply Center Columbus (DSCC); (5)Available in -3 speed; (6)System performance beyond 50 MHz; (7)Flexible array architecture; (8)Low power segmented routing architecture; (9)Buffered Interconnect for maximum speed; (10)New latch capability in configurable logic blocks; (11)Improved VersaRingI/O interconnect for better Fixed pinout flexibility: Virtually unlimited number of clock signals; (12)Optional multiplexer or 2-input function generator on device outputs; (13)5V tolerant I/Os; (14)0.35 μm SRAM process.
Diagrams
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XQ4000E |
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XQ4000EX |
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